Presentation title
Thermal analysis and management of multi-core systemsAuthors
William FornaciariInstitution(s)
Politecnico di milano - DEIBPresentation type
Technical presentationAbstract
Since a few years, the value of multi-core architecture is taken into account also for embedded applications. The goal of this presentation is threefold: i) to describe the main issues in modeling the thermal transient of multi-core chips; ii) to present a low overhead event-based control strategy (and the related hw/sw architecture), capable to deal with the occurring of hot-spots; iii) to show how these type of solutions can be integrated in a run-time resource manager.
Part of the presented results are the foreground of the FP7-HARPA, H2020-MANGO and H2020-M2DC EU-funded projects.
Additional material
- Presentation slides: [pdf]
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